MC33PF8200DEES - NXP

MC33PF8200DEES Details

• Manufacturer Part Number:

  MC33PF8200DEES

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Not Recommended

• Package Description:

  HVQFN-56

• Country Of Origin:

  Mainland China, Taiwan

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.01

• Factory Lead Time:

  16 Weeks

• Date Of Intro:

  2019-04-29

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  8

• Adjustable Threshold:

  YES

• Analog IC - Other Type:

  INTEGRATED POWER MANAGEMENT UNIT

• JESD-30 Code:

  S-PQCC-N56

• JESD-609 Code:

  e3

• Length:

  8 mm

• Moisture Sensitivity Level:

  3

• Number of Channels:

  12

• Number of Functions:

  1

• Number of Terminals:

  56

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVQCCN

• Package Equivalence Code:

  LCC56,.31SQ,20

• Package Shape:

  SQUARE

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  1 mm

• Supply Voltage-Max (Vsup):

  5.5 V

• Supply Voltage-Min (Vsup):

  2.5 V

• Supply Voltage-Nom (Vsup):

  5 V

• Surface Mount:

  YES

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Threshold Voltage-Nom:

  +2.6V

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  8 mm