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MC3487DRE4 - Texas Instruments

Description: RS-422 Interface IC Quad Diff Line

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MC3487DRE4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16) (1)
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MC3487DRE4 - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16) (1)
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MC3487DRE4 Details

  • Manufacturer Part Number:

    MC3487DRE4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia, Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00005 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-422-B; TIA-422-B; V.11

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.048 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    85 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.25 V

  • Supply Voltage1-Min:

    4.75 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    20 ns

  • Width:

    3.9 mm

MC3487DRE4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. Additionally, it's recommended to have a minimum of 10 vias under the package to connect the thermal pad to the ground plane.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines. This includes providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range and power dissipation limits.
  • Although the datasheet specifies a recommended operating voltage range of 4.5V to 5.5V, the absolute maximum rating for the VCC pin is 6.5V. However, it's essential to note that operating the device at voltages above 5.5V may affect its reliability and performance.
  • The MC3487DRE4 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during manufacturing and assembly. This includes using ESD-safe materials, grounding personnel and equipment, and using ESD protection devices such as TVS diodes or ESD suppressors.
  • Texas Instruments recommends using a 0.1uF to 1uF ceramic capacitor with a voltage rating of 10V or higher as a VCC bypass capacitor. The capacitor should be placed as close as possible to the VCC pin and connected to the ground plane.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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