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MC34PF3001A3EP - NXP

Description: PMIC Solutions Power Management IC, i.MX7, pre-prog, 3 buck, 6 LDO, QFN 48, Tray

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Symbol
MC34PF3001A3EP - NXP - PCB symbol
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PCB Footprints
MC34PF3001A3EP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 98ASA00719D
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3D Models
MC34PF3001A3EP - NXP - 3D model - Quad Flat No-Lead - 98ASA00719D
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MC34PF3001A3EP Details

  • Manufacturer Part Number:

    MC34PF3001A3EP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    QFN-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2016-03-03

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Additional Feature:

    OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-XQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC34PF3001A3EP Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC34PF3001A3EP involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure the stability of the output voltage, it is recommended to use a minimum output capacitance of 10uF, and to place a 10nF capacitor in parallel with a 10uF capacitor to filter out high-frequency noise. Additionally, the output voltage should be monitored and adjusted as needed to prevent oscillations.
  • The MC34PF3001A3EP can handle a maximum input voltage of 18V, but it is recommended to operate within the specified input voltage range of 2.7V to 16V for optimal performance and reliability.
  • To protect the MC34PF3001A3EP from overcurrent and overheating, it is recommended to use an external current limit resistor, and to implement thermal monitoring and shutdown mechanisms. Additionally, the device should be operated within the specified operating temperature range of -40°C to 125°C.
  • The recommended input capacitor value for the MC34PF3001A3EP is 1uF to 10uF, depending on the input voltage and output current requirements. A larger input capacitor can help to reduce input voltage ripple and improve overall system stability.

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MC34PF3001A3EP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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