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MC34PF3001A4EP - NXP

Description: Power Management Specialized - PMIC Power Management IC, i.MX7, pre-prog, 3 buck, 6 LDO, QFN 48

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PCB Footprints
MC34PF3001A4EP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48QFn
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3D Models
MC34PF3001A4EP - NXP  - 3D model - Quad Flat No-Lead - 48QFn
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MC34PF3001A4EP Details

  • Manufacturer Part Number:

    MC34PF3001A4EP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    QFN-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2016-03-03

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Additional Feature:

    OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-XQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC34PF3001A4EP Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for this device. Ensure a solid ground plane, keep the input and output traces short and separate, and use a common mode filter to reduce EMI. Refer to NXP's application note AN5071 for more details.
  • The input capacitor value depends on the input voltage, output voltage, and desired ripple voltage. A general rule of thumb is to use a capacitor with a value between 1uF to 10uF. Consult the datasheet and application notes for specific guidance.
  • The MC34PF3001A4EP can deliver up to 1.5A of output current. However, this value may vary depending on the input voltage, output voltage, and ambient temperature. Be sure to check the datasheet for thermal derating and output current limitations.
  • The MC34PF3001A4EP has built-in OVP and UVP features. To implement these features, connect the OVP pin to a voltage divider network that sets the desired overvoltage threshold. For UVP, connect the UVP pin to a voltage divider network that sets the desired undervoltage threshold. Refer to the datasheet for specific implementation details.
  • The EN (enable) pin is used to turn the device on or off. Connect the EN pin to a logic high (VCC) to enable the device, and connect it to a logic low (GND) to disable the device. This pin can be used to implement power sequencing or to turn off the device during shutdown or standby modes.

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MC34PF3001A4EP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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