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MC34PF8100A0EP - NXP

Description: Power Management Specialized - PMIC Power Management IC, i.MX8, non-prog, 7 buck, 4 LDO, Industrial, QFN 56

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PCB Footprints
MC34PF8100A0EP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN56 (Industrial grade)
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3D Models
MC34PF8100A0EP - NXP  - 3D model - Quad Flat No-Lead - HVQFN56 (Industrial grade)
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MC34PF8100A0EP Details

  • Manufacturer Part Number:

    MC34PF8100A0EP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HVQFN-56

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-04-29

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-XQCC-N56

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +2.6V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC34PF8100A0EP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a thermal management strategy, such as heat sinks, thermal interfaces, or fans. Ensure the device is operated within the specified temperature range (-40°C to 150°C) and consider derating the device for high-temperature applications.
  • Use X7R or X5R ceramic capacitors with a minimum capacitance of 4.7uF for input and output filtering. Ensure the capacitors are placed close to the device and have a low ESL (Equivalent Series Inductance) for optimal performance.
  • Use a shielded enclosure, keep sensitive components away from the device, and ensure proper grounding and decoupling. Implement EMI filters or common-mode chokes if necessary. Follow NXP's EMI design guidelines for optimal results.
  • Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal. A soft-start circuit can be implemented to reduce inrush current and ensure a smooth startup.

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MC34PF8100A0EP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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