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MC34PF8100FJEP - NXP

Description: Power Management Specialized - PMIC Power Management IC, i.MX8, pre-prog, 7 buck, 4 LDO, Industrial, QFN 56

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PCB Footprints
MC34PF8100FJEP - NXP PCB footprint - Other - Other - HVQFN56-2024
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MC34PF8100FJEP - NXP  - 3D model - Other - HVQFN56-2024
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MC34PF8100FJEP Details

  • Manufacturer Part Number:

    MC34PF8100FJEP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HVQFN-56

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-09-20

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +2.6V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC34PF8100FJEP Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC34PF8100FJEP involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To optimize the performance of the MC34PF8100FJEP in a noisy environment, use a low-pass filter on the input, add a shield around the device, and use a ferrite bead or a common-mode choke to filter out high-frequency noise. Additionally, use a low-ESR capacitor for decoupling and keep the analog and digital circuits separate.
  • The MC34PF8100FJEP has an operating temperature range of -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, and the maximum junction temperature should not exceed 150°C.
  • To troubleshoot issues with the MC34PF8100FJEP, start by checking the power supply voltage, decoupling, and PCB layout. Use an oscilloscope to check the input and output waveforms, and verify that the device is properly configured. Check the datasheet and application notes for specific troubleshooting guidelines.
  • Yes, the MC34PF8100FJEP can be used in battery-powered devices. However, it's essential to consider the device's power consumption, which is typically around 1.5mA. Use a low-dropout regulator and a power-saving mode to minimize power consumption and extend battery life.

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MC34PF8100FJEP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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