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MC74VHC139DR2G-Q - onsemi

Description: Low Power Dissipation: ICC = 4mA (Max) at TA = 25°C; High Speed: tPD = 5.0ns (Typ) at VCC = 5V; Designed for 2V to 5.5V Operating Range; Chip Complexity: 100 FETs or 25 Equivalent Gates; Latchup Performance Exceeds 300mA; Pin and Function Compatible with Other Standard Logic Families; ESD Performance: HBM > 2000V; Machine Model > 200V; High Noise Immunity: VNIH = VNIL = 28% VCC; Power Down Protection Provided on Inputs; Balanced Propagation Delays; Low Noise: VOLP = 0.8 V (Max)

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PCB Footprints
MC74VHC139DR2G-Q - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−16 9.90x3.90x1.37 1.27P CASE 751B ISSUE M
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3D Models
MC74VHC139DR2G-Q - onsemi  - 3D model - Small Outline Packages - SOIC−16 9.90x3.90x1.37 1.27P CASE 751B ISSUE M
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MC74VHC139DR2G-Q Details

  • Manufacturer Part Number:

    MC74VHC139DR2G-Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • Family:

    AHC/VHC/H/U/V

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    2-LINE TO 4-LINE DECODER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.04 mA

  • Prop. Delay@Nom-Sup:

    10.5 ns

  • Propagation Delay (tpd):

    16.5 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

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