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MC74VHC139DR2G - onsemi

Description: Low Power Dissipation: ICC = 4mA (Max) at TA = 25°C; High Speed: tPD = 5.0ns (Typ) at VCC = 5V; Designed for 2V to 5.5V Operating Range; Chip Complexity: 100 FETs or 25 Equivalent Gates; Latchup Performance Exceeds 300mA; Pin and Function Compatible with Other Standard Logic Families; ESD Performance: HBM > 2000V; Machine Model > 200V; High Noise Immunity: VNIH = VNIL = 28% VCC; Power Down Protection Provided on Inputs; Balanced Propagation Delays; Low Noise: VOLP = 0.8 V (Max)

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MC74VHC139DR2G - onsemi - PCB symbol
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MC74VHC139DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP 16
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MC74VHC139DR2G - onsemi - 3D model - Small Outline Packages - TSSOP 16
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MC74VHC139DR2G Details

  • Manufacturer Part Number:

    MC74VHC139DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC 16 LEAD

  • Pin Count:

    16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Family:

    AHC/VHC

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    2-LINE TO 4-LINE DECODER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    10.5 ns

  • Propagation Delay (tpd):

    16.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MC74VHC139DR2G Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the MC74VHC139DR2G is 2.0V to 5.5V.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking and airflow, and ensuring that the device is operated within its specified temperature range (-40°C to 125°C).
  • The maximum clock frequency that the MC74VHC139DR2G can handle is 100 MHz.
  • The MC74VHC139DR2G is a 2.0V to 5.5V device, so it can be directly interfaced with 3.3V or 5V logic. However, it is recommended to use voltage translation or level shifting if the logic levels are not compatible.
  • The power consumption of the MC74VHC139DR2G depends on the operating frequency and voltage. At 3.3V and 25°C, the typical quiescent current is 10 μA, and the dynamic current is 10 mA at 50 MHz.

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MC74VHC139DR2G Overview

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