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MC74VHC157DTR2G - onsemi

Description: Latchup Performance Exceeds 300mA; High Speed: tPD = 4.1ns (Typ) at VCC = 5V; Balanced Propagation Delays; Power Down Protection Provided on Inputs; Chip Complexity: 82 FETs or 20 Equivalent Gates; Pin and Function Compatible with Other Standard Logic Families; ESD Performance: HBM > 2000V; Machine Model > 200V; High Noise Immunity: VNIH = VNIL = 28% VCC; Low Noise: VOLP = 0.8V (Max); Designed for 2V to 5.5V Operating Range; Low Power Dissipation: ICC = 4mA (Max) at TA = 25°C; These devices are available in

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MC74VHC157DTR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-16
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MC74VHC157DTR2G - onsemi  - 3D model - Small Outline Packages - TSSOP-16
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MC74VHC157DTR2G Details

  • Manufacturer Part Number:

    MC74VHC157DTR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-16

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    948F-01

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Family:

    AHC/VHC

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    MULTIPLEXER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.04 mA

  • Prop. Delay@Nom-Sup:

    9.5 ns

  • Propagation Delay (tpd):

    15 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MC74VHC157DTR2G Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the MC74VHC157DTR2G is 2.0V to 5.5V.
  • To ensure signal integrity, use a low-impedance output driver, minimize trace lengths, and use a ground plane to reduce noise and electromagnetic interference (EMI).
  • The maximum frequency of operation for the MC74VHC157DTR2G is 200 MHz.
  • To handle thermal management, ensure good airflow, use a heat sink if necessary, and follow proper PCB design guidelines to minimize thermal resistance.
  • Yes, the MC74VHC157DTR2G is compatible with both 3.3V and 5V logic systems, making it a versatile component for various applications.

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