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MC74VHCT50ADTR2G-Q - onsemi

Description: High Speed: tPD = 3.5ns (Typ) at VCC = 5V; Low Power Dissipation: ICC = 2mA (Max) at TA = 25°C; TTL-Compatible Inputs: VIL = 0.8V; VIH = 2.0V; Power Down Protection Provided on Inputs and Outputs; CMOS-Compatible Outputs: VOH > 0.8VCC; VOL < 0.1VCC @Load; These devices are available in Pb-free package(s). Specifications herein apply to both standard and Pb-free devices. Please see our website at www.onsemi.com for specific Pb-free orderable part numbers, or contact your local ON Semiconductor sales office o

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MC74VHCT50ADTR2G-Q - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP−14 WB CASE 948G ISSUE C_2024
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MC74VHCT50ADTR2G-Q - onsemi  - 3D model - Small Outline Packages - TSSOP−14 WB CASE 948G ISSUE C_2024
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MC74VHCT50ADTR2G-Q Details

  • Manufacturer Part Number:

    MC74VHCT50ADTR2G-Q

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-14 WB

  • Manufacturer Package Code:

    948G

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Family:

    AHCT/VHCT/VT

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    6

  • Number of Inputs:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    10.5 ns

  • Propagation Delay (tpd):

    13 ns

  • Schmitt Trigger:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

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