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MCH3486-TL-W - onsemi

Description: Single N-Channel Power MOSFET 60V, 2A, 137mΩ

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MCH3486-TL-W - onsemi  - 3D model
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MCH3486-TL-W Details

  • Manufacturer Part Number:

    MCH3486-TL-W

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC 70FL / MCPH3

  • Manufacturer Package Code:

    419AQ

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Drain Current-Max (ID):

    2 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Time@Peak Reflow Temperature-Max (s):

    30

MCH3486-TL-W Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider using a heat sink or thermal interface material to reduce the junction temperature.
  • The MCH3486-TL-W has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • Yes, the MCH3486-TL-W is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and to consider additional testing and validation to ensure the device meets the specific requirements of your application.
  • Follow the recommended soldering profile, and ensure that the PCB is designed with a suitable land pattern to accommodate the device's package. Additionally, consider using a reflow oven with a controlled atmosphere to minimize oxidation and ensure reliable solder joints.

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MCH3486-TL-W Overview

Use the download button to access the MCH3486-TL-W 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MCH34, or try a keyword search, such as Small Signal Field-Effect Transistors

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