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MCH6660-TL-H - onsemi

Description: Mosfet Array 20V 2A, 1.5A 800mW Surface Mount 6-MCPH -55 to +150 °C

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PCB Footprints
MCH6660-TL-H - onsemi PCB footprint - Other - Other - SC-88FL / MCPH6 CASE 419AS ISSUE O_2026
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3D Models
MCH6660-TL-H - onsemi  - 3D model - Other - SC-88FL / MCPH6 CASE 419AS ISSUE O_2026
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MCH6660-TL-H Details

  • Manufacturer Part Number:

    MCH6660-TL-H

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SC-88FL,SC-70, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    419AS

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    2 A

  • Drain-source On Resistance-Max:

    0.136 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MCH6660-TL-H Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system accordingly.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, use 10uF to 22uF, and for output capacitors, use 4.7uF to 10uF.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and ensure proper grounding and decoupling. Implement a common-mode choke and EMI filters if necessary.
  • Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal.

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