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MCP100T-315I/TT - Microchip

Description: Voltage Supervisor 3.075V Act.Low SOT23

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PCB Footprints
MCP100T-315I/TT - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - MCP100T-315I/TT
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3D Models
MCP100T-315I/TT - Microchip  - 3D model - SOT23 (3-Pin) - MCP100T-315I/TT
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MCP100T-315I/TT Details

  • Manufacturer Part Number:

    MCP100T-315I/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.08V

  • Width:

    1.3 mm

MCP100T-315I/TT Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range (-40°C to +125°C). Use a heat sink or thermal pad to dissipate heat, and avoid overheating the device. Also, ensure that the PCB is designed to minimize thermal resistance and that the device is properly soldered.
  • The recommended soldering conditions for the MCP100T-315I/TT are: peak temperature of 260°C, soldering time of 10-15 seconds, and a soldering iron temperature of 350°C. Ensure that the device is handled by trained personnel, and that the soldering process is performed in a controlled environment.
  • To troubleshoot issues with the device's thermal performance, check the PCB layout for thermal bottlenecks, ensure that the device is properly soldered, and verify that the thermal pad or heat sink is properly attached. Use thermal imaging or temperature measurement tools to identify hotspots, and consult the datasheet for thermal performance specifications.
  • The recommended storage conditions for the MCP100T-315I/TT are: temperature range of -40°C to +125°C, humidity of 60% or less, and protection from direct sunlight and moisture. Store the devices in their original packaging or in a dry, clean environment.

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MCP100T-315I/TT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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