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MCP100T-450I/TT - Microchip

Description: Voltage Supervisor 4.375V Act.Low SOT23

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Symbol
MCP100T-450I/TT - Microchip - PCB symbol
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PCB Footprints
MCP100T-450I/TT - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - MCP100T-450I/TT
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3D Models
MCP100T-450I/TT - Microchip - 3D model - SOT23 (3-Pin) - MCP100T-450I/TT
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MCP100T-450I/TT Details

  • Manufacturer Part Number:

    MCP100T-450I/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    4.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.38V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

MCP100T-450I/TT Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the package can help to dissipate heat efficiently. It's also recommended to keep the thermal path short and direct to the heat sink or thermal pad.
  • Ensure that the device is operated within the recommended temperature range (-40°C to +125°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material to improve heat transfer. Also, ensure that the PCB is designed to withstand high temperatures.
  • Use a metal shield or a shielded enclosure to reduce EMI and RFI emissions. Ensure that the PCB is designed with EMI and RFI considerations in mind, such as using a solid ground plane, minimizing trace lengths, and using EMI filters or chokes as needed.
  • Ensure that the power supplies are sequenced correctly to prevent damage to the device. Use a power-on reset (POR) circuit to ensure that the device is reset properly during power-up. Also, ensure that the voltage ramp-up and ramp-down rates are within the recommended specifications.
  • Use a reflow soldering process with a peak temperature of 260°C or less. Avoid using wave soldering or hand soldering, as it can damage the device. For rework, use a hot air rework station with a temperature-controlled heat source and a vacuum pickup tool to avoid damaging the device or PCB.

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MCP100T-450I/TT Overview

Use the download button to access the MCP100T-450I/TT schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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