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MCP101T-475I/TT - Microchip

Description: uP supervisor IC,MCP101T-475I/TT 4.625V

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PCB Footprints
MCP101T-475I/TT - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - MCP101T-475I/TT
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3D Models
MCP101T-475I/TT - Microchip  - 3D model - SOT23 (3-Pin) - MCP101T-475I/TT
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MCP101T-475I/TT Details

  • Manufacturer Part Number:

    MCP101T-475I/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.62V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

MCP101T-475I/TT Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink if possible. The datasheet provides some guidelines, but a more detailed application note is available on Microchip's website.
  • In addition to following the recommended PCB layout, ensure that the device is properly soldered, and consider using a thermal interface material (TIM) to improve heat transfer. Also, make sure to derate the device's power handling according to the temperature derating curve in the datasheet.
  • The device is not designed to handle high short-circuit currents. Ensure that your system design includes adequate overcurrent protection, such as fuses or current-limiting resistors, to prevent damage to the device.
  • To minimize parasitic inductance and capacitance, use a compact PCB layout, and consider using a shielded inductor. Also, ensure that the device is properly decoupled with capacitors, and consider using a common-mode choke to reduce EMI.
  • The device has limited power handling during startup, so ensure that your system design includes a soft-start circuit or a gradual power-up sequence to prevent overheating or damage to the device.

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MCP101T-475I/TT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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