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MCP33131D-10-E/MN - Microchip

Description: Analog to Digital Converters - ADC 16-bit,1 Msps, single channel, differential SAR ADC

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MCP33131D-10-E/MN - Microchip - PCB symbol
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PCB Footprints
MCP33131D-10-E/MN - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 10-Lead Thin Plastic Dual Flat,No Lead Package (MN) -3x3x0.8mm Body [TDFN]
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3D Models
MCP33131D-10-E/MN - Microchip - 3D model - Small Outline No-lead - 10-Lead Thin Plastic Dual Flat,No Lead Package (MN) -3x3x0.8mm Body [TDFN]
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MCP33131D-10-E/MN Details

  • Manufacturer Part Number:

    MCP33131D-10-E/MN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    TDFN-10

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Date Of Intro:

    2018-11-14

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Analog Input Voltage-Max:

    5.1 V

  • Analog Input Voltage-Min:

    -5.1 V

  • Conversion Time-Max:

    0.75 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.00915%

  • Number of Analog In Channels:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2'S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Sample Rate:

    1 MHz

  • Screening Level:

    AEC-Q100; TS 16949

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    2.4 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

MCP33131D-10-E/MN Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the MCP33131D-10-E/MN evaluation board user's guide, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The MCP33131D-10-E/MN does not require calibration, as it is a digitally calibrated ADC. However, it's essential to follow the recommended layout and routing guidelines to minimize noise and ensure accurate readings.
  • The maximum sampling rate of the MCP33131D-10-E/MN is 1 Msps. To achieve this rate, ensure that the clock frequency is set to 20 MHz, and the conversion mode is set to 'Fast' mode. Additionally, optimize the SPI interface timing and ensure that the microcontroller can handle the data transfer rate.
  • The MCP33131D-10-E/MN provides error flags and status registers that can be used to detect and handle errors, such as overflow, underflow, and CRC errors. Implement error handling routines in your firmware to detect and respond to these errors, and consider using interrupts to notify the microcontroller of error conditions.
  • Yes, the MCP33131D-10-E/MN can be used in a multi-channel configuration. To configure it, connect multiple devices in a daisy-chain configuration, and use the 'Channel Select' pins to select the desired channel. Ensure that the microcontroller can handle the increased data transfer rate and implement the necessary firmware to manage the multiple channels.

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MCP33131D-10-E/MN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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