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MCP37D10-200I/TE - Microchip

Description: 1-Channel Single ADC Pipelined 200Msps 12-bit Parallel/Serial (SPI)/LVDS 121-Pin TFBGA Tray

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MCP37D10-200I/TE - Microchip PCB footprint - BGA - BGA - 121-Ball Plastic Thin Profile Fine Pitch Ball Grid Array (TE) -
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MCP37D10-200I/TE - Microchip - 3D model - BGA - 121-Ball Plastic Thin Profile Fine Pitch Ball Grid Array (TE) -
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MCP37D10-200I/TE Details

  • Manufacturer Part Number:

    MCP37D10-200I/TE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA-121

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.C.2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    6.25

  • Conversion Time-Max:

    0.005 µs

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PBGA-B121

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    121

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2'S COMPLEMENT BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA121,11X11,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Sample Rate:

    200 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.08 mm

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

MCP37D10-200I/TE Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the device's datasheet and application notes. It's essential to follow these guidelines to ensure optimal performance, especially for high-frequency signals. Key considerations include keeping analog and digital signals separate, using a solid ground plane, and minimizing trace lengths and impedance mismatches.
  • The MCP37D10-200I/TE has a built-in calibration mechanism. The device performs a self-calibration sequence during power-up, which includes offset and gain calibration. However, if additional calibration is required, the device provides a calibration register that can be accessed through the SPI interface. Refer to the datasheet and application notes for more information on calibration procedures.
  • The maximum sampling rate of the MCP37D10-200I/TE is 37.5 kSPS. The power consumption of the device increases with the sampling rate. At the maximum sampling rate, the device consumes around 12.5 mW. However, the power consumption can be reduced by lowering the sampling rate or using the device's power-down modes.
  • The MCP37D10-200I/TE provides error flags and interrupt mechanisms to handle overflow, underflow, and other error conditions. The device's status register can be read to determine the type of error that has occurred. The application software should be designed to handle these errors and take appropriate action, such as resetting the device or retrying the conversion.
  • Yes, the MCP37D10-200I/TE can be used in a multi-channel application. The device has a built-in multiplexer that allows it to connect to multiple analog input channels. The channel selection is done through the SPI interface, and the device can be configured to scan multiple channels in a sequential or simultaneous manner. Refer to the datasheet and application notes for more information on multi-channel configuration and operation.

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MCP37D10-200I/TE Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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MCP37D10-200I/TE Alternates

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Part Image MCP37D10T-200I/TE Microchip Technology Inc

ADC, PIPELINED, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, PBGA121