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MCP37D11-80E/TE - Microchip

Description: Analog to Digital Converters - ADC 12-bit, 80 Msps, Pipelined ADC with 8-channel Mux with DDC

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MCP37D11-80E/TE - Microchip PCB footprint - BGA - BGA - 121-Ball Plastic Thin Profile Fine Pitch Ball Grid Array (TE) -
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MCP37D11-80E/TE Details

  • Manufacturer Part Number:

    MCP37D11-80E/TE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA-121

  • Pin Count:

    121

  • Manufacturer Package Code:

    SIP-121

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Analog Input Voltage-Max:

    2.975 V

  • Analog Input Voltage-Min:

    -2.975 V

  • Conversion Time-Max:

    0.004 µs

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PBGA-B121

  • Length:

    8 mm

  • Number of Analog In Channels:

    8

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    121

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT, OFFSET BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA121,11X11,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Sample Rate:

    80 MHz

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.08 mm

  • Supply Current-Max:

    173 mA

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

MCP37D11-80E/TE Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the device's datasheet and application notes. It's essential to follow these guidelines to ensure optimal performance, especially for high-frequency signals. Key considerations include keeping analog and digital signals separate, using a solid ground plane, and minimizing trace lengths and impedance mismatches.
  • The MCP37D11-80E/TE has a built-in calibration mechanism. The device performs a self-calibration sequence during power-up, which includes offset and gain calibration. Additionally, the device provides a calibration register that allows users to fine-tune the ADC's performance. Refer to the datasheet and application notes for more information on calibration procedures and register settings.
  • The maximum sampling rate of the MCP37D11-80E/TE is 37.5 Msps. As the sampling rate increases, so does the power consumption. The device's power consumption is proportional to the sampling rate, with a typical current consumption of 35 mA at 37.5 Msps. To minimize power consumption, consider reducing the sampling rate or using the device's power-down modes.
  • The MCP37D11-80E/TE has a parallel interface that can be connected to a microcontroller or FPGA. The device provides a 16-bit data bus and control signals such as CS, RD, and WR. The interface can be configured as a slave device, and the microcontroller or FPGA can control the ADC's operation using the control signals. Refer to the datasheet and application notes for more information on interface timing and protocol.
  • The MCP37D11-80E/TE has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to implement a thermal management strategy. This can include using a heat sink, thermal interface material, and ensuring good airflow around the device. The device's thermal resistance (θJA) is 30°C/W, and the maximum power dissipation is 1.2 W. Refer to the datasheet and application notes for more information on thermal management.

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MCP37D11-80E/TE Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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