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MCP37D31-200E/TE - Microchip

Description: IC ADC 16BIT PIPELINED 121TFBGA

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MCP37D31-200E/TE - Microchip - PCB symbol
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MCP37D31-200E/TE - Microchip PCB footprint - BGA - BGA - 121-Ball Plastic Thin Profile Fine Pitch Ball Grid Array (TE) -
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MCP37D31-200E/TE - Microchip - 3D model - BGA - 121-Ball Plastic Thin Profile Fine Pitch Ball Grid Array (TE) -
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MCP37D31-200E/TE Details

  • Manufacturer Part Number:

    MCP37D31-200E/TE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA-121

  • Pin Count:

    121

  • Manufacturer Package Code:

    SIP-121

  • Country Of Origin:

    South Korea

  • ECCN Code:

    3A001.A.5.A.5

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2019-12-10

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Analog Input Voltage-Max:

    4.46 V

  • Analog Input Voltage-Min:

    -4.46 V

  • Conversion Time-Max:

    0.025 µs

  • Converter Type:

    ADC, FLASH METHOD

  • JESD-30 Code:

    S-PBGA-B121

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    8

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    121

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2'S COMPLEMENT BINARY

  • Output Format:

    SERIAL, PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA121,11X11,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Sample Rate:

    200 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.08 mm

  • Supply Current-Max:

    300 mA

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

MCP37D31-200E/TE Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the device's datasheet and application notes. It's essential to follow these guidelines to ensure optimal performance, especially for high-frequency signals. Key considerations include keeping analog and digital signals separate, using a solid ground plane, and minimizing trace lengths and impedance mismatches.
  • The MCP37D31-200E/TE has a built-in calibration feature that can be accessed through the device's registers. The calibration process involves writing specific values to the calibration registers to adjust the ADC's offset and gain. Microchip provides detailed calibration procedures in the device's datasheet and application notes.
  • The maximum sampling rate of the MCP37D31-200E/TE is 37.5 Msps. However, the actual sampling rate may be limited by the input signal frequency and the device's analog bandwidth. For optimal performance, the input signal frequency should be less than half the sampling rate to avoid aliasing. Microchip provides guidelines for selecting the optimal sampling rate based on the input signal frequency in the device's datasheet.
  • The MCP37D31-200E/TE has built-in overvoltage protection (OVP) and undervoltage protection (UVP) features to prevent damage from excessive voltage levels on the analog input pins. However, it's still essential to add external protection circuitry, such as voltage clamps or resistors, to limit the voltage levels to within the device's specified range. Microchip provides guidelines for designing overvoltage and undervoltage protection circuits in the device's datasheet and application notes.
  • The power consumption of the MCP37D31-200E/TE depends on the operating mode, sampling rate, and other factors. Microchip provides detailed power consumption specifications in the device's datasheet. To optimize power consumption, designers can use power-down modes, reduce the sampling rate, and minimize the number of active channels. Additionally, using a low-power mode or shutting down the device when not in use can help reduce overall power consumption.

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MCP37D31-200E/TE Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image MCP37D31T-200I/TE Microchip Technology Inc

ADC, Flash Method, 16-Bit, 1 Func, 8 Channel, Serial, Parallel, Word Access, PBGA121
Part Image MCP37D31-200I/TE Microchip Technology Inc

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