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MCP73213T-A61I/MF - Microchip

Description: Battery Management OVP BATTERY CHARGER DUAL CELL

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MCP73213T-A61I/MF - Microchip - PCB symbol
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MCP73213T-A61I/MF - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - (MF)10-Lead(DFN)
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MCP73213T-A61I/MF - Microchip - 3D model - Small Outline No-lead - (MF)10-Lead(DFN)
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MCP73213T-A61I/MF Details

  • Manufacturer Part Number:

    MCP73213T-A61I/MF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    DFN-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    16 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    9.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP73213T-A61I/MF Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding scheme, using a solid ground plane, and keeping analog and digital traces separate to minimize noise. Additionally, use a 10uF capacitor between VDD and VSS, and a 1uF capacitor between AVDD and AVSS.
  • To ensure stability, use a 1uF capacitor between VIN and GND, and a 10uF capacitor between VOUT and GND. Also, ensure the input voltage is within the recommended range (2.7V to 5.5V) and the output current is within the specified limit (150mA).
  • Power up the device in the following sequence: VIN, then VDD, and finally AVDD. This ensures the internal voltage regulator is stable before the analog circuitry is powered up.
  • The thermal shutdown feature is activated when the device temperature exceeds 150°C. To handle this, implement a thermal monitoring system to detect overheating, and take corrective action such as reducing the output current or shutting down the device.
  • Use a reflow soldering process with a peak temperature of 240°C for 10-30 seconds. Ensure the device is handled by the edges to prevent damage, and avoid applying excessive force or bending the leads.

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MCP73213T-A61I/MF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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