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mEZD41501A-B - Monolithic Power Systems (MPS)

Description: Non-Isolated DC/DC Converters 2.7V-10V Input, 1A, 12V Output, Step-Up Power Supply

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mEZD41501A-B - Monolithic Power Systems (MPS) - PCB symbol
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PCB Footprints
mEZD41501A-B - Monolithic Power Systems (MPS) PCB footprint - Other - Other - mEZD41501A-B-4
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mEZD41501A-B - Monolithic Power Systems (MPS) - 3D model - Other - mEZD41501A-B-4
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mEZD41501A-B Details

  • Manufacturer Part Number:

    MEZD41501A-B

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    PACKAGE-6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    64 Weeks

  • Manufacturer:

    Monolithic Power Systems

  • YTEOL:

    0

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Efficiency (Main Output):

    96.7%

  • Input Voltage-Max:

    10 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    6.6 V

  • JESD-30 Code:

    R-XSMA-T6

  • Length:

    27 mm

  • Line Regulation-Max:

    0.2%

  • Load Regulation-Max:

    0.5%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    12.264 V

  • Output Voltage-Min:

    11.736 V

  • Output Voltage-Nom:

    12 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SMA

  • Package Equivalence Code:

    MODULE,6LEAD(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Protections:

    OVER TEMPERATURE; SHORT CIRCUIT

  • Ripple Voltage (Main Out):

    0.0176 Vrms

  • Seated Height-Max:

    20 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Total Power Output-Max:

    12 W

  • Trim/Adjustable Output:

    NO

  • Width:

    5.4 mm

mEZD41501A-B Frequently Asked Questions (FAQs)

  • A good PCB layout for the MEZD41501A-B should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure that the thermal vias are connected to a solid copper plane on the bottom layer. Keep the copper plane as large as possible to dissipate heat efficiently.
  • To ensure the MEZD41501A-B operates within the SOA, monitor the device's junction temperature (TJ) and output current (IO). Keep TJ below the maximum rating (150°C) and IO within the specified range (up to 1.5A). Also, ensure the input voltage (VIN) is within the recommended range (2.7V to 5.5V).
  • A low-ESR ceramic capacitor (X5R or X7R dielectric) with a value between 1μF to 10μF is recommended for the input capacitor (CIN). This helps to filter out noise and ensure stable operation.
  • To minimize EMI, use a shielded inductor, keep the layout compact, and use a common-mode choke or ferrite bead on the output. Also, ensure the device is placed away from sensitive analog circuits and antennas.
  • A low-ESR ceramic capacitor (X5R or X7R dielectric) with a value between 1μF to 22μF is recommended for the output capacitor (COUT). This helps to filter out noise and ensure stable operation.

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mEZD41501A-B Overview

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