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- Stock & Prices $ Price & Stock for MF-FSML035/8-2
- Part Number MF-FSML035/8-2
- Manufacturer Bourns
- Pin Count 2
- Part Category Resettable Fuse
- Package Category Fuses Chip
- Footprint Name Fuses Chip - MF-FSML035/8-2
- Released Date Nov 27, 2019
- Last Modified Date Sep 10, 2025 9:47 AM UTC
- Pinout / Pin List Click Here (Member Only)
MF-FSML035/8-2 Details
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Manufacturer Part Number:
MF-FSML035/8-2
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8533.40.80.70
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Manufacturer:
Bourns Inc
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YTEOL:
8
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Additional Feature:
RMIN AT 23 DEG CEL
MF-FSML035/8-2 Frequently Asked Questions (FAQs)
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Bourns provides a recommended PCB layout and land pattern in their application note AN164, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal management and minimize parasitic inductance.
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Bourns offers a fuse selection guide on their website, which takes into account factors such as voltage, current, and power ratings. Engineers can use this guide to determine the most suitable fuse for their application. Additionally, consulting with a Bourns representative or a qualified electrical engineer can provide further guidance.
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The MF-FSML035/8-2 fuse is designed to operate within a specific temperature range (-40°C to 125°C) and humidity level (up to 95% RH). Engineers should ensure that their application meets these conditions to guarantee optimal performance and lifespan. Additionally, factors like vibration, shock, and altitude can also impact the fuse's performance.
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The MF-FSML035/8-2 fuse is designed for general-purpose applications. For high-reliability or safety-critical applications, engineers should consider using fuses that meet specific industry standards, such as AEC-Q200 or IEC 60127-1. Bourns offers a range of fuses that meet these standards, and engineers should consult with a Bourns representative to determine the most suitable option.
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Bourns provides soldering guidelines and recommendations for PCB assembly in their application note AN164. Engineers should follow these guidelines to ensure proper soldering and assembly techniques, including using the correct soldering temperature, flux, and cleaning procedures.
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MF-FSML035/8-2 Overview
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