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MF-NSML260-2 - Bourns

Description: PTC Resettable Fuse 2A(hold) 4A(trip) 6V 50A 0.8W 4s 0.005Ohm SMD Solder Pad 1206

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MF-NSML260-2 - Bourns PCB footprint - Other - Other - MF-NSML260-2-2
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MF-NSML260-2 - Bourns  - 3D model - Other - MF-NSML260-2-2
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MF-NSML260-2 Details

  • Manufacturer Part Number:

    MF-NSML260-2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.70

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    0

  • Additional Feature:

    RMIN AT 23 DEG CEL

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.5 mm

  • Package Style:

    SMT

  • Package Width:

    1.8 mm

  • Packing Method:

    TR, 7 INCH

  • Reference Standard:

    CUL; TUV; UL

  • Resistance:

    0.003 Ω

  • Resistor Type:

    PTC RESETTABLE FUSE

  • Surface Mount:

    YES

  • Terminal Finish:

    GOLD OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Thermistor Application:

    OVERCURRENT PROTECTION

  • Working Voltage:

    6 V

MF-NSML260-2 Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application note AN164, which can be found on their website. It's essential to follow these guidelines to ensure optimal performance and minimize parasitic effects.
  • The MF-NSML260-2 has a maximum operating temperature of 125°C. To ensure reliable operation, it's crucial to consider thermal derating, especially in high-power applications. Bourns provides thermal derating curves in their datasheet, which can help engineers determine the maximum allowable current at a given temperature.
  • Bourns recommends following the IPC/JEDEC J-STD-020D.1 standard for soldering and reflow processes. The recommended soldering temperature profile is 260°C peak reflow temperature, with a maximum of 3 reflow cycles.
  • To minimize EMI effects, it's essential to ensure proper magnetic shielding. Bourns recommends using a shielded enclosure or a metal can package for the inductor. Additionally, keeping the inductor away from other sensitive components and using proper PCB layout techniques can help reduce EMI effects.
  • The SRF of the MF-NSML260-2 is not explicitly stated in the datasheet, but it can be estimated using the inductor's inductance and capacitance values. The SRF can affect the design by causing unwanted resonances and affecting the overall circuit performance. Engineers should consider the SRF when designing the circuit and take necessary measures to mitigate its effects.

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