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MF-USMF150-2 - Bourns

Description: Resettable Fuses - PPTC PTC RESETTABLE 1.5A 6V SMD 1210

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PCB Footprints
MF-USMF150-2 - Bourns PCB footprint - Fuses Chip - Fuses Chip - 3mm*2.35mm*0.85mm
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3D Models
MF-USMF150-2 - Bourns  - 3D model - Fuses Chip - 3mm*2.35mm*0.85mm
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MF-USMF150-2 Details

  • Manufacturer Part Number:

    MF-USMF150-2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.70

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    8.25

  • Additional Feature:

    RMIN AT 23 DEG CEL

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.85 mm

  • Package Length:

    3.43 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.8 mm

  • Packing Method:

    TR, 7 INCH

  • Reference Standard:

    CUL; TUV; UL

  • Resistance:

    0.03 Ω

  • Resistor Type:

    PTC RESETTABLE FUSE

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Thermistor Application:

    OVERCURRENT PROTECTION

  • Working Voltage:

    6 V

MF-USMF150-2 Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application notes. It's essential to follow these guidelines to ensure optimal performance, low inductance, and minimal parasitic effects.
  • To handle the high current rating, ensure your PCB design includes adequate copper thickness, width, and spacing to minimize resistive losses and thermal issues. Also, consider using multiple vias and thermal vias to dissipate heat effectively.
  • The MF-USMF150-2 has a high current rating, which generates heat. Ensure good airflow, use thermal interfaces or heat sinks if necessary, and consider the thermal resistance of the component and PCB to prevent overheating.
  • While the MF-USMF150-2 is designed for high-current applications, it may not be suitable for high-frequency applications due to its inductive nature. Be cautious when using it in high-frequency circuits, and consider the component's self-resonant frequency and impedance characteristics.
  • To ensure reliability and longevity, follow proper storage and handling procedures, avoid exceeding the component's ratings, and consider the operating environment's temperature, humidity, and vibration. Also, implement adequate protection circuits and fuses to prevent overcurrent and overvoltage conditions.

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