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MFS2303BMBA3EP - NXP

Description: Power Management Specialized - PMIC Safety SBC with Power Management, CAN and LIN , 40µA , 5.5V ~ 40V , -40°C ~ 125°C

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Symbol
MFS2303BMBA3EP - NXP - PCB symbol
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PCB Footprints
MFS2303BMBA3EP - NXP PCB footprint - Other - Other - SOT619-27(D)_2025-1.5
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3D Models
MFS2303BMBA3EP - NXP - 3D model - Other - SOT619-27(D)_2025-1.5
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MFS2303BMBA3EP Details

  • Manufacturer Part Number:

    MFS2303BMBA3EP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    13

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Time@Peak Reflow Temperature-Max (s):

    40

MFS2303BMBA3EP Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11542, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MFS2303BMBA3EP has a low-power mode that can be enabled by setting the PMU_CTRL register to 0x01. This reduces the device's power consumption to approximately 10 μA. Additionally, the device can be put into a deep sleep mode by setting the PMU_CTRL register to 0x02, which reduces power consumption to around 1 μA.
  • The MFS2303BMBA3EP is rated for operation in the -40°C to 105°C temperature range, making it suitable for use in a wide range of industrial and automotive applications.
  • Yes, the MFS2303BMBA3EP is designed for use in battery-powered applications. It has a low quiescent current and can operate from a single 1.8V to 3.6V battery supply, making it suitable for use in battery-powered devices such as IoT sensors, wearables, and other portable devices.
  • NXP provides a secure boot and firmware update mechanism through its Secure Firmware Update (SFU) tool. The SFU tool uses a combination of cryptographic algorithms and secure boot mechanisms to ensure that only authorized firmware can be loaded onto the device. Additionally, the device has a built-in cryptographic accelerator that can be used to implement secure boot and firmware update mechanisms.

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MFS2303BMBA3EP Overview

Use the download button to access the MFS2303BMBA3EP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MFS23, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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