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MFS2613AMBA0AD - NXP

Description: Power Management Specialised - PMIC Safety System Basis Chip with Low Power for ASIL B, LQFP-48 tray

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MFS2613AMBA0AD - NXP - PCB symbol
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PCB Footprints
MFS2613AMBA0AD - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1571-6
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3D Models
MFS2613AMBA0AD - NXP - 3D model - Quad Flat Packages - SOT1571-6
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MFS2613AMBA0AD Details

  • Manufacturer Part Number:

    MFS2613AMBA0AD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    3.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MFS2613AMBA0AD Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the MFS2613AMBA0AD application note (AN11524). It's essential to follow these guidelines to ensure optimal performance, thermal stability, and to prevent overheating.
  • To achieve optimal power efficiency, configure the device in low-power mode (LPM) when not transmitting. Adjust the bias current, output power, and modulation scheme according to your application's requirements. Refer to the datasheet and application notes for specific guidance.
  • Impedance matching and tuning are crucial for optimal performance. Ensure that the PCB layout and component selection provide a 50-ohm impedance match. Use simulation tools and measurement techniques to optimize the matching network. NXP provides guidance on impedance matching in the application notes.
  • To troubleshoot output power droop or frequency drift, check the device's operating conditions, such as temperature, voltage, and current. Verify that the device is properly biased and that the output matching network is optimized. Use measurement tools like spectrum analyzers and oscilloscopes to identify the root cause of the issue.
  • NXP recommends using industry-standard test and measurement procedures, such as those outlined in the IEEE 802.11 standard. Use equipment like vector signal generators, spectrum analyzers, and oscilloscopes to characterize the device's performance, including output power, frequency, and modulation quality.

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MFS2613AMBA0AD Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like MFS26, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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