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MFS2613AMDA2AD - NXP

Description: Power Management Specialized - PMIC Safety System Basis Chip with Low Power for ASIL D, LQFP-48 tray

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PCB Footprints
MFS2613AMDA2AD - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1571-6
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MFS2613AMDA2AD - NXP  - 3D model - Quad Flat Packages - SOT1571-6
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MFS2613AMDA2AD Details

  • Manufacturer Part Number:

    MFS2613AMDA2AD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    3.2 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MFS2613AMDA2AD Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Follow the recommended PCB layout, use a shielded enclosure, and ensure proper grounding and bonding. Additionally, use EMI filters and shielding on the input/output lines.
  • The MFS2613AMDA2AD is rated for operation from -40°C to 125°C (junction temperature). However, the recommended operating temperature range is -20°C to 85°C for optimal performance and reliability.
  • The POR and BOR features are enabled by default. To handle them, ensure a stable power supply, use a capacitor on the VDD pin, and implement a reset circuit that can detect and respond to POR and BOR events.
  • Use 100 nF to 1 μF decoupling capacitors on the VDD pin, placed as close to the device as possible. Additional decoupling capacitors may be required on the analog and digital power pins, depending on the specific application.

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MFS2613AMDA2AD Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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