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MFS2613AMDDCAD - NXP

Description: Safety System Basis Chip with Low Power for ASIL D, LQFP-48 tray

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MFS2613AMDDCAD Details

  • Manufacturer Part Number:

    MFS2613AMDDCAD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Country Of Origin:

    Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    3.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MFS2613AMDDCAD Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in their application note AN12213, which includes guidelines for thermal pad connection, PCB layer stack-up, and heat sink design.
  • To optimize the MFS2613AMDDCAD for low power consumption, engineers can use the device's built-in power-saving features, such as dynamic voltage scaling, clock gating, and power gating. Additionally, optimizing the system's clock frequency, using low-power modes, and minimizing idle time can also help reduce power consumption.
  • To ensure EMI and EMC compliance, engineers should follow NXP's guidelines for PCB layout, component selection, and shielding. They should also consider using EMI filters, ferrite beads, and shielding cans to minimize electromagnetic radiation. Additionally, conducting EMC testing and simulation can help identify and mitigate potential issues.
  • NXP provides a range of debugging tools, including the LPCXpresso IDE, which offers a debug probe and software development tools. Engineers can also use oscilloscopes, logic analyzers, and other test equipment to troubleshoot issues. Additionally, NXP's technical support and community forums can provide valuable resources and guidance.
  • NXP provides reliability and quality metrics for the MFS2613AMDDCAD, including MTBF (Mean Time Between Failures), FIT (Failure In Time), and AEC-Q100 qualification. Engineers can find this information in the device's datasheet, reliability report, and quality documentation.

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MFS2613AMDDCAD Overview

Use the download button to access the MFS2613AMDDCAD 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MFS26, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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