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MFS2621AMDABAD - NXP

Description: Power Management Specialized - PMIC Safety System Basis Chip with Low Power for ASIL D, LQFP-48 tray

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MFS2621AMDABAD - NXP - PCB symbol
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PCB Footprints
MFS2621AMDABAD - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1571-6
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3D Models
MFS2621AMDABAD - NXP - 3D model - Quad Flat Packages - SOT1571-6
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MFS2621AMDABAD Details

  • Manufacturer Part Number:

    MFS2621AMDABAD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    3.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MFS2621AMDABAD Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11568, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MFS2621AMDABAD has a low-power mode that can be enabled by setting the PMODE pin to a logic low level. Additionally, the device can be configured for low-power mode using the SPI interface by writing to the Power Management Register (PMR). Refer to the datasheet and application notes for detailed instructions.
  • The MFS2621AMDABAD is rated for operation from -40°C to +125°C (junction temperature). However, the device's performance and reliability may degrade at extreme temperatures. It's essential to ensure proper thermal management and design considerations to maintain optimal performance within the specified temperature range.
  • Yes, the MFS2621AMDABAD is a standalone device that can be used with any microcontroller that supports SPI communication. However, NXP provides optimized software libraries and example code for their microcontrollers, which may simplify the integration process.
  • NXP provides a troubleshooting guide in the application note AN11569, which covers common issues and debugging techniques for the MFS2621AMDABAD. Additionally, engineers can use tools like logic analyzers and oscilloscopes to debug the SPI communication and identify potential issues.

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MFS2621AMDABAD Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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