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MFS2633AMBA0AD - NXP

Description: Safety System Basis Chip with Low Power for ASIL D / ASIL B

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MFS2633AMBA0AD - NXP - PCB symbol
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MFS2633AMBA0AD - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - MFS2633AMBA0AD
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MFS2633AMBA0AD - NXP - 3D model - Quad Flat Packages - MFS2633AMBA0AD
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MFS2633AMBA0AD Details

  • Manufacturer Part Number:

    MFS2633AMBA0AD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    11

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    3.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MFS2633AMBA0AD Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the MFS2633AMBA0AD application note (AN11524). It's essential to follow these guidelines to ensure optimal performance, thermal stability, and to prevent overheating.
  • To achieve optimal power efficiency, configure the device in low-power mode (LPM) by setting the appropriate registers (e.g., REG_LPM) and adjusting the bias current (IBIAS) according to the application's requirements. Refer to the datasheet and application notes for more information.
  • NXP provides recommended input and output matching networks in the MFS2633AMBA0AD application note (AN11524). These networks are optimized for specific frequency bands and can be adjusted according to the application's requirements.
  • To troubleshoot common issues, follow the troubleshooting guide in the MFS2633AMBA0AD application note (AN11524). This guide provides step-by-step procedures to identify and resolve issues like oscillation or instability. Additionally, consult the datasheet and NXP's support resources for further assistance.
  • The MFS2633AMBA0AD has a maximum junction temperature (TJ) of 150°C. Derating factors are provided in the datasheet, and it's essential to consider these factors when designing the thermal management system to ensure the device operates within the recommended temperature range.

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MFS2633AMBA0AD Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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