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MFS2633AMDA0AD - NXP

Description: Power Management Specialized - PMIC Safety System Basis Chip with Low Power for ASIL D, LQFP-48 tray

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MFS2633AMDA0AD - NXP - PCB symbol
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PCB Footprints
MFS2633AMDA0AD - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1571-6_2024
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3D Models
MFS2633AMDA0AD - NXP - 3D model - Quad Flat Packages - SOT1571-6_2024
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MFS2633AMDA0AD Details

  • Manufacturer Part Number:

    MFS2633AMDA0AD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    3.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MFS2633AMDA0AD Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the layout symmetrical and avoid vias under the device. Use a 50-ohm microstrip line for the RF output.
  • Use the lowest possible supply voltage, enable the power-down mode when not transmitting, and optimize the transmit power level. Also, consider using a low-power mode for the crystal oscillator.
  • Use a 26 MHz crystal with a load capacitance of 10-20 pF and a series resistance of 1-2 kohm. Ensure the crystal is placed close to the device and the layout is symmetrical.
  • Implement error correction mechanisms like CRC and checksum. Use a robust modulation scheme like GFSK or MSK. Ensure proper antenna design and placement, and implement a retry mechanism for failed transmissions.
  • The MFS2633AMDA0AD is rated for operation from -40°C to 85°C. However, the device's performance may degrade at extreme temperatures. Ensure proper thermal design and heat dissipation in your application.

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MFS2633AMDA0AD Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like MFS26, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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