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MFS5600AMMA0ES - NXP

Description: NXP - MFS5600AMMA0ES - Multi Function Power Management IC, AEC-Q100, 2 Output, 36V Supply, WFQFN-EP-32, -40 °C to 125 °C

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Symbol
MFS5600AMMA0ES - NXP - PCB symbol
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PCB Footprints
MFS5600AMMA0ES - NXP PCB footprint - Other - Other - SOT617-24(SC)
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3D Models
MFS5600AMMA0ES - NXP - 3D model - Other - SOT617-24(SC)
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MFS5600AMMA0ES Details

  • Manufacturer Part Number:

    MFS5600AMMA0ES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    POWER SUPPLY MANAGEMENT CIRCUIT

  • JESD-30 Code:

    S-XQCC-N32

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    14 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    1.4

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5 mm

MFS5600AMMA0ES Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in their application note AN12213, which includes guidelines for thermal pad connection, PCB layer stack-up, and heat sink design.
  • To optimize the MFS5600AMMA0ES for low power consumption, engineers can use the device's built-in power-saving features, such as dynamic voltage and frequency scaling, and adjust the operating frequency and voltage according to their application's requirements.
  • Engineers should follow NXP's guidelines for EMC and EMI in their application note AN12214, which includes recommendations for PCB layout, component selection, and shielding to minimize electromagnetic radiation and susceptibility.
  • To ensure reliable operation in harsh environments, engineers should follow NXP's guidelines for environmental testing and qualification, and consider using additional protection measures such as conformal coating, potting, or hermetic sealing.
  • NXP provides a comprehensive testing and validation guide in their application note AN12215, which includes procedures for functional testing, performance testing, and environmental testing to ensure the device meets the required specifications.

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MFS5600AMMA0ES Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like MFS56, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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