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MIC2043-1YM - Microchip

Description: Power Switch ICs - Power Distribution 35 mohm Low Voltage Switch

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MIC2043-1YM - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SOP (M)-1
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MIC2043-1YM - Microchip  - 3D model - Small Outline Packages - 8-Pin SOP (M)-1
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MIC2043-1YM Details

  • Manufacturer Part Number:

    MIC2043-1YM

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    7

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.9 mm

  • Supply Current-Max (Isup):

    0.4 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +0.225V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MIC2043-1YM Frequently Asked Questions (FAQs)

  • A good thermal layout is crucial for the MIC2043-1YM. It's recommended to have a solid ground plane on the bottom layer, and to use thermal vias to connect the thermal pad to the ground plane. Additionally, keep the thermal path as short as possible and avoid routing signals under the IC.
  • To ensure reliable operation over the full temperature range, make sure to follow the recommended operating conditions, including voltage and current ratings. Also, consider the thermal derating of the device and ensure proper heat sinking. Finally, validate your design through thorough testing and characterization.
  • For EMI and EMC compliance, ensure that the MIC2043-1YM is properly decoupled, and that the PCB layout is designed to minimize radiation. Use shielding and filtering as needed, and follow good design practices for signal routing and grounding. Additionally, consider using a common-mode choke and TVS diodes for added protection.
  • To troubleshoot issues with the MIC2043-1YM, start by verifying the power supply and input voltage. Check for proper decoupling and ensure that the device is operated within its recommended operating conditions. Use an oscilloscope to monitor the output voltage and current, and consult the datasheet and application notes for guidance on specific troubleshooting techniques.
  • The MIC2043-1YM's quiescent current can have a significant impact on your system's power budget, especially in low-power or battery-powered applications. Be sure to factor in the quiescent current when calculating your system's overall power consumption, and consider using power-saving modes or shutdown features to minimize power draw when possible.

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MIC2043-1YM Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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