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MIC2790L-04VD6-T5 - Microchip

Description: Supervisor Push-Pull, Totem Pole 1 Channel TSOT-23-6

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MIC2790L-04VD6-T5 - Microchip - PCB symbol
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PCB Footprints
MIC2790L-04VD6-T5 - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT-26-6L
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3D Models
MIC2790L-04VD6-T5 - Microchip - 3D model - SOT23 (6-Pin) - TSOT-26-6L
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MIC2790L-04VD6-T5 Details

  • Manufacturer Part Number:

    MIC2790L-04VD6-T5

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    TSOT-6

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    24.61

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:Y;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.08 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +0.4V

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Width:

    1.6 mm

MIC2790L-04VD6-T5 Frequently Asked Questions (FAQs)

  • A good PCB layout for the MIC2790L-04VD6-T5 should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A 4-layer board with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable operation at high temperatures, ensure that the device is properly heatsinked, and the PCB is designed to minimize thermal resistance. Also, follow the recommended operating conditions and derating guidelines provided in the datasheet.
  • The MIC2790L-04VD6-T5 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of 2kV HBM (Human Body Model) and 200V MM (Machine Model) ESD protection is recommended.
  • Yes, the MIC2790L-04VD6-T5 is suitable for high-reliability and automotive applications. It's AEC-Q100 qualified and meets the requirements for automotive applications. However, ensure that the device is used within the recommended operating conditions and follow the guidelines for high-reliability applications.
  • The thermal impedance (Zth) of the MIC2790L-04VD6-T5 is typically around 2.5°C/W, and the junction-to-case thermal resistance (RθJC) is around 1.5°C/W. These values can be used to estimate the junction temperature and ensure reliable operation.

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MIC2790L-04VD6-T5 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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