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MIC706TMY-TR - Microchip

Description: Supervisory Circuits uP Supervisor, Watchdog Timer, 3.08V VTH

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MIC706TMY-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8 SOIC (M)
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MIC706TMY-TR - Microchip  - 3D model - Small Outline Packages - 8 SOIC (M)
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MIC706TMY-TR Details

  • Manufacturer Part Number:

    MIC706TMY-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.4V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.94 mm

MIC706TMY-TR Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal or bottom-side copper plane.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 125°C. Also, consider the power dissipation and thermal resistance of the package when designing the system.
  • Use a shielded enclosure and ensure that the PCB layout minimizes radiation. Use a common-mode choke or ferrite bead on the input lines to reduce EMI. Also, consider using a shielded cable for the input power.
  • The input capacitor values depend on the input voltage, output voltage, and output current. A general rule of thumb is to use a capacitor with a value of 1-10 μF, with a voltage rating of at least 1.5 times the input voltage.
  • The output capacitor should be selected based on the output voltage, output current, and ripple requirements. A general rule of thumb is to use a capacitor with a value of 10-100 μF, with a voltage rating of at least 1.5 times the output voltage.

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MIC706TMY-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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