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MIC803-26D3VC3-TR - Microchip

Description: Supervisory Circuits

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MIC803-26D3VC3-TR - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC70-
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MIC803-26D3VC3-TR - Microchip  - 3D model - SOT23 (3-Pin) - SC70-
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MIC803-26D3VC3-TR Details

  • Manufacturer Part Number:

    MIC803-26D3VC3-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    SC70-3

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e4

  • Length:

    2.025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP3/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.018 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.63V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.25 mm

MIC803-26D3VC3-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation across the entire operating temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal management strategy, and ensure that the device is operated within its specified voltage and current limits.
  • If the enable pin (EN) is not used and is tied to VIN or GND, the device will always be enabled, and power consumption will be higher. This can lead to increased heat generation and reduced efficiency.
  • The output capacitor should be chosen based on the required output voltage ripple, output current, and stability considerations. A general rule of thumb is to use a capacitor with a value between 10uF to 22uF, and a voltage rating that exceeds the output voltage.
  • Not using an input capacitor (CIN) or using a capacitor with a low ESR can lead to instability, increased noise, and reduced efficiency. It's recommended to use a capacitor with a value between 1uF to 10uF and a low ESR to ensure stable operation.

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MIC803-26D3VC3-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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