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MIC803-30D3VC3-TR - Microchip

Description: Supervisory Circuits 3-Pin Microprocessor Supervisor Circuit w/ Open-Drain Reset Output

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MIC803-30D3VC3-TR - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC70-
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3D Models
MIC803-30D3VC3-TR - Microchip  - 3D model - SOT23 (3-Pin) - SC70-
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MIC803-30D3VC3-TR Details

  • Manufacturer Part Number:

    MIC803-30D3VC3-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP, TSSOP3/6,.08

  • Pin Count:

    3

  • Manufacturer Package Code:

    SC70-3

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e4

  • Length:

    2.025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP3/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.018 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

MIC803-30D3VC3-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable startup, make sure to follow the recommended startup sequence, provide a stable input voltage, and ensure that the input capacitor is properly sized to handle the inrush current.
  • Key considerations for EMI filtering include using a common-mode choke, adding a capacitor in parallel with the input, and ensuring that the layout is designed to minimize radiated emissions.
  • To troubleshoot issues, start by checking the input voltage, output voltage, and current draw. Verify that the component values are correct and that the PCB layout is correct. Use an oscilloscope to check for oscillations or noise on the output.
  • Operating the MIC803-30D3VC3-TR at high ambient temperatures can reduce its reliability and lifespan. Ensure that the device is properly heatsinked and that the thermal design is adequate to handle the increased temperature.

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MIC803-30D3VC3-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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