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MIC803-41D2VC3-TR - Microchip

Description: Supervisory Circuits 3-Pin Microprocessor Supervisor Circuit w/ Open-Drain Reset Output

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MIC803-41D2VC3-TR - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC70
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3D Models
MIC803-41D2VC3-TR - Microchip  - 3D model - SOT23 (3-Pin) - SC70
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MIC803-41D2VC3-TR Details

  • Manufacturer Part Number:

    MIC803-41D2VC3-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    SC70-3

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e4

  • Length:

    2.025 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP3/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.018 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.1V

  • Width:

    1.25 mm

MIC803-41D2VC3-TR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to have a solid ground plane on the bottom layer of the PCB, and to use thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the PCB traces away from the device and using a thermal relief pattern around the device can help to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, and to consider derating the device's power dissipation according to the ambient temperature. Additionally, using a heat sink or thermal interface material can help to reduce the device's junction temperature.
  • The recommended input capacitor is a 10uF ceramic capacitor with a voltage rating of 10V or higher, and the recommended output capacitor is a 22uF ceramic capacitor with a voltage rating of 10V or higher. However, the specific capacitor values and types may vary depending on the application and operating conditions.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and feedback resistors for proper connection and values. Also, verify that the device is properly configured and that the output capacitor is suitable for the application. If the issue persists, consult the datasheet and application notes for further guidance.
  • The recommended soldering profile for this device is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. However, the specific soldering profile may vary depending on the PCB material and assembly process.

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MIC803-41D2VC3-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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