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MIC826LYMT-TR - Microchip

Description: Supervisory Circuits Voltage Supervisor Watchdog/Dual Output

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Symbol
MIC826LYMT-TR - Microchip - PCB symbol
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PCB Footprints
MIC826LYMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - TDFN 6PIN
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3D Models
MIC826LYMT-TR - Microchip - 3D model - Small Outline No-lead - TDFN 6PIN
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MIC826LYMT-TR Details

  • Manufacturer Part Number:

    MIC826LYMT-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    UDFN-6

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max (Isup):

    0.014 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    4.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.625V

  • Width:

    1.6 mm

MIC826LYMT-TR Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, and to consider the device's thermal derating. The MIC826LYMT-TR is rated for operation up to 125°C, but the maximum junction temperature should not exceed 150°C.
  • Microchip recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, placed as close as possible to the VIN pin. The capacitor should be rated for the input voltage and have a low equivalent series resistance (ESR) to minimize voltage ripple.
  • The output voltage ripple can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency. A lower ESL and higher Cout value can help minimize output voltage ripple.
  • Microchip recommends using a high-quality, low-loss PCB material such as FR4 or Rogers 4350B, with a minimum thickness of 0.0625 inches (1.6 mm) to minimize thermal resistance and ensure reliable operation.

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MIC826LYMT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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