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MIC826RYMT-TR - Microchip

Description: Supervisory Circuits Voltage Supervisor Watchdog/Dual Output

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Symbol
MIC826RYMT-TR - Microchip - PCB symbol
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PCB Footprints
MIC826RYMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 6-PIN 1.6X1.6MM TDFN
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3D Models
MIC826RYMT-TR - Microchip - 3D model - Small Outline No-lead - 6-PIN 1.6X1.6MM TDFN
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MIC826RYMT-TR Details

  • Manufacturer Part Number:

    MIC826RYMT-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    UDFN-6

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max (Isup):

    0.0084 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.625V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.6 mm

MIC826RYMT-TR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the PCB layout allows for good airflow around the device.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range (–40°C to +125°C). Also, consider using thermal management techniques such as heat sinks, thermal interfaces, or forced air cooling to keep the device temperature within a safe operating range.
  • The recommended input capacitor is a 10uF ceramic capacitor with X7R or X5R dielectric, and the recommended output capacitor is a 22uF ceramic capacitor with X7R or X5R dielectric. These capacitors help to filter out noise and ensure stable operation.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output voltage, and output current. Ensure that the input voltage is within the specified range, and the output voltage is within the desired range. Also, check for any signs of overheating, and verify that the device is properly soldered and connected.
  • To minimize EMI and EMC issues, ensure that the device is placed away from noise-sensitive components, and use proper PCB layout techniques such as separating analog and digital grounds. Additionally, use shielding or filtering techniques to reduce electromagnetic radiation.

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MIC826RYMT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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