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MIC826TYMT-TR - Microchip

Description: Supervisory Circuits .5% Single Voltage Supervisor

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MIC826TYMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 6 - pin 1.6 mm x 1.6 mm TDFN
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3D Models
MIC826TYMT-TR - Microchip  - 3D model - Small Outline No-lead - 6 - pin 1.6 mm x 1.6 mm TDFN
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MIC826TYMT-TR Details

  • Manufacturer Part Number:

    MIC826TYMT-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    UDFN-6

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max (Isup):

    0.0084 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3.15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.075V

  • Width:

    1.6 mm

MIC826TYMT-TR Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias under the package, and a heat sink if possible. Refer to Microchip's application note AN1123 for more details.
  • Follow the recommended operating conditions, ensure good thermal design, and consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Use a good PCB layout, decouple the input and output, and consider adding EMI filters or shielding to minimize electromagnetic interference.
  • Choose capacitors with low ESR, high ripple current rating, and suitable voltage rating. Refer to the datasheet for recommended capacitor values and types.
  • Higher switching frequencies can improve efficiency but may increase EMI. Lower output voltages can improve efficiency but may require more complex circuitry. Optimize based on specific application requirements.

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MIC826TYMT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image MIC826TYMT-T5 Microchip Technology Inc

Voltage Supervisor/Reset IC, Fixed, 1 Channel, +3.075V, PDSO6