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MIC826YYMT-TR - Microchip

Description: Processor Supervisor 2.188V 2 Active High/Active Low/Push-Pull 6-Pin TDFN EP T/R

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PCB Footprints
MIC826YYMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 6-PIN 1.6X1.6MM TDFN
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3D Models
MIC826YYMT-TR - Microchip  - 3D model - Small Outline No-lead - 6-PIN 1.6X1.6MM TDFN
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MIC826YYMT-TR Details

  • Manufacturer Part Number:

    MIC826YYMT-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    UDFN-6

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max (Isup):

    0.0084 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    2.25 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.188V

  • Width:

    1.6 mm

MIC826YYMT-TR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the PCB layout allows for good airflow around the device.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered. Additionally, consider using a thermally conductive heat sink or a heat spreader to dissipate heat efficiently.
  • To mitigate EMI and RFI, ensure that the PCB layout is designed to minimize radiation and susceptibility. Use a multi-layer PCB with a solid ground plane, and consider using shielding or a metal can to enclose the device. Additionally, use EMI filters or common-mode chokes to reduce emissions and susceptibility.
  • When selecting input and output capacitors, consider the device's operating frequency, output current, and voltage rating. Choose capacitors with low ESR, high ripple current rating, and a suitable voltage rating. X5R or X7R ceramic capacitors are recommended for their high reliability and low ESR.
  • For soldering and rework, use a soldering iron with a temperature range of 250°C to 300°C. Apply a small amount of solder paste or flux to the pads, and use a gentle touch to avoid damaging the device. For rework, use a hot air rework station or a soldering iron with a fine tip to avoid overheating the device.

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MIC826YYMT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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