- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for MICROASMD005F-2
- Part Number MICROASMD005F-2
- Manufacturer LITTELFUSE
- Pin Count 2
- Part Category Fuse
- Package Category Other
- Footprint Name Other - MICROASMD005F-2-5
- Released Date Jun 18, 2021
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
MICROASMD005F-2 Details
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Manufacturer Part Number:
MICROASMD005F-2
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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ECCN Code:
EAR99
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HTS Code:
8533.40.80.70
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Manufacturer:
Littelfuse Inc
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YTEOL:
8.25
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Additional Feature:
Rmin@25 Deg Cel
MICROASMD005F-2 Frequently Asked Questions (FAQs)
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The recommended footprint and land pattern for MICROASMD005F-2 can be found in the Littelfuse application note AN9313, which provides guidelines for surface mount assembly of this device.
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To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a thermally conductive interface material to improve heat dissipation.
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Yes, the MICROASMD005F-2 is suitable for high-frequency circuits. However, it is recommended to consider the device's parasitic inductance and capacitance when designing the circuit, and to follow the guidelines for high-frequency circuit design provided in the Littelfuse application note AN9314.
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To prevent damage, it is recommended to handle the MICROASMD005F-2 by the body, avoiding touching the leads or the glass passivation. Store the devices in a dry, cool place, away from direct sunlight and moisture.
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Yes, it is recommended to follow the soldering guidelines provided in the Littelfuse application note AN9315, which includes recommendations for soldering temperature, time, and flux type.
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MICROASMD005F-2 Overview
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