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MICROSMD010F-2 - LITTELFUSE

Description: Micro SMD polyswitch fuse,100mA TE Connectivity 0.1A Surface Mount Resettable Fuse, 30 V dc

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Symbol
MICROSMD010F-2 - LITTELFUSE - PCB symbol
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PCB Footprints
MICROSMD010F-2 - LITTELFUSE PCB footprint - Other - Other - MICROSMD005F-2
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3D Models
MICROSMD010F-2 - LITTELFUSE - 3D model - Other - MICROSMD005F-2
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MICROSMD010F-2 Details

  • Manufacturer Part Number:

    MICROSMD010F-2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.70

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.25

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.85 mm

  • Package Length:

    3.43 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.8 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Reference Standard:

    CSA; TUV; UL

  • Resistance:

    2.1 Ω

  • Resistor Type:

    PTC RESETTABLE FUSE

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Thermistor Application:

    OVERCURRENT PROTECTION

  • Working Voltage:

    30 V

MICROSMD010F-2 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MICROSMD010F-2 is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm.
  • Yes, MICROSMD010F-2 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
  • Handle the device by the body, avoiding touching the leads or the glass passivation. Use a vacuum pickup or tweezers to handle the device during assembly and rework. Avoid bending or flexing the leads, as this can cause damage.
  • Store MICROSMD010F-2 in a dry, cool place, away from direct sunlight and moisture. Handle the devices in an ESD-protected environment, and avoid exposing them to mechanical stress or vibration.
  • Yes, MICROSMD010F-2 is designed for high-reliability applications, with a failure rate of < 1 FIT (failures per 10^9 hours) at 125°C. However, the device's reliability may vary depending on the application and operating conditions.

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MICROSMD010F-2 Overview

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