Description:Lead Formed Version in 16 mm Tape and Reel ("T4" Suffix); High DC Current Gain hFE = 2,500 (Typ) @ IC = 2.0 Adc; Monolithic Construction With Built-in Base-Emitter Shunt Resistors; Lead Formed for Surface Mount Applications in Plastic Sleeves (No Suffix); Straight Lead Version in Plastic Sleeves ("1" Suffix); Surface Mount Replacements for TIP110-TIP117 Series; Complementary Pairs Simplifies Designs; NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-
A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, thermal vias can be used to connect the thermal pad to the copper area.
Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the device when designing the system.
The MJD112-1G has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures when handling the device. A minimum of 2kV human body model (HBM) and 200V machine model (MM) ESD protection is recommended.
Yes, the MJD112-1G is suitable for high-reliability applications. It is manufactured using a high-reliability process and is qualified to automotive and industrial standards. However, it is recommended to consult with onsemi's application engineers to ensure the device meets the specific requirements of the application.
The recommended soldering conditions are: peak temperature of 260°C, time above 217°C of 30 seconds, and a total process time of 60 seconds. It is also recommended to follow the IPC-J-STD-020 standard for soldering.
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MJD112-1G Overview
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