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MJD3055T4G - onsemi

Description: Bipolar (BJT) Transistor NPN 60 V 10 A 2MHz 1.75 W Surface Mount DPAK

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PCB Footprints
MJD3055T4G - onsemi PCB footprint - Other - Other - DPAK (SINGLE GAUGE) CASE 369C ISSUE G_2025-7
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3D Models
MJD3055T4G - onsemi  - 3D model - Other - DPAK (SINGLE GAUGE) CASE 369C ISSUE G_2025-7
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MJD3055T4G Details

  • Manufacturer Part Number:

    MJD3055T4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK (SINGLE GAUGE) TO-252

  • Pin Count:

    3

  • Manufacturer Package Code:

    369C

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    10 A

  • Collector-Emitter Voltage-Max:

    60 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    5

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    20 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    2 MHz

MJD3055T4G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MJD3055T4G is -55°C to 150°C.
  • To ensure proper biasing, the MJD3055T4G requires a minimum of 10mA of collector current and a maximum of 1.5A of collector current. Additionally, the base-emitter voltage should be between 0.65V and 0.85V.
  • For optimal thermal performance, it is recommended to use a PCB with a thermal pad and to ensure good thermal conductivity between the device and the heat sink. A minimum of 2oz copper thickness is recommended for the PCB.
  • To protect the MJD3055T4G from ESD, it is recommended to handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure that all equipment and tools are properly grounded.
  • The recommended soldering conditions for the MJD3055T4G are a peak temperature of 260°C, a dwell time of 10-30 seconds, and a soldering iron temperature of 350°C.

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MJD3055T4G Overview

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