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MM9Z1J638BM2EP - NXP

Description: NXP - MM9Z1J638BM2EP - BATT SUPERVISOR & MONITOR, HVQFN-48

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Symbol
MM9Z1J638BM2EP - NXP - PCB symbol
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PCB Footprints
MM9Z1J638BM2EP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT619-1
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3D Models
MM9Z1J638BM2EP - NXP - 3D model - Quad Flat No-Lead - SOT619-1
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MM9Z1J638BM2EP Details

  • Manufacturer Part Number:

    MM9Z1J638BM2EP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-48

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO OPERATES AT 3.8 TO 28 VOLT

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    BATTERY MONITOR

  • JESD-30 Code:

    S-XQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Supply Current-Max (Isup):

    40 mA

  • Supply Voltage-Max (Vsup):

    1.98 V

  • Supply Voltage-Min (Vsup):

    1.72 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +28V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MM9Z1J638BM2EP Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would involve placing thermal vias under the MM9Z1J638BM2EP, using a solid ground plane, and keeping the component away from other heat sources. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation across the entire operating temperature range, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement a robust thermal management system. Additionally, consider using a temperature sensor to monitor the device temperature and adjust the system accordingly.
  • For EMI and EMC compliance, ensure proper PCB layout, use a shielded enclosure, and implement filtering and shielding techniques. Also, follow the recommended layout guidelines for the MM9Z1J638BM2EP, and consider using a common-mode choke to reduce emissions.
  • To troubleshoot and debug issues with the MM9Z1J638BM2EP, use a systematic approach, checking the power supply, input/output signals, and thermal conditions. Utilize oscilloscopes, logic analyzers, and other diagnostic tools to identify the root cause of the issue. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Operating the MM9Z1J638BM2EP at the maximum junction temperature can reduce the device's lifespan and reliability. It's essential to ensure proper thermal management and consider derating the device to maintain a safe operating temperature. Consult the datasheet and reliability reports for more information.

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MM9Z1J638BM2EP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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