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MMBT5551LT3G - onsemi

Description: Miniature SOT-23 Surface Mount Package Saves Board Space; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
MMBT5551LT3G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23 (TO−236) CASE 318 ISSUE AT_2023
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3D Models
MMBT5551LT3G - onsemi  - 3D model - SOT23 (3-Pin) - SOT−23 (TO−236) CASE 318 ISSUE AT_2023
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MMBT5551LT3G Details

  • Manufacturer Part Number:

    MMBT5551LT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    1999-01-01

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.06 A

  • Collector-Emitter Voltage-Max:

    160 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    30

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    200 MHz

  • VCEsat-Max:

    0.2 V

MMBT5551LT3G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MMBT5551LT3G is -55°C to 150°C.
  • To ensure reliability, follow proper thermal management practices, such as providing adequate heat sinking and minimizing thermal resistance. Also, ensure that the device is operated within its recommended operating conditions.
  • The recommended storage temperature range for the MMBT5551LT3G is -55°C to 150°C.
  • Yes, the MMBT5551LT3G can be used in switching applications, but it's essential to ensure that the device is operated within its recommended switching frequency and voltage ratings to prevent overheating and premature failure.
  • To prevent electrostatic discharge (ESD) damage, handle the MMBT5551LT3G with proper ESD protection equipment, such as wrist straps and anti-static mats. Also, ensure that the device is stored in anti-static packaging.

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MMBT5551LT3G Overview

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Part Image MMBT5551_NL Fairchild Semiconductor Corporation

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For a full list of alternate parts for MMBT5551LT3G, check out Findchips.com