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MMBT6520LT1G - onsemi

Description: Low rDS(on) Provides Higher Efficiency and Extends Battery Life; Miniature SOT-23 Surface Mount Package Saves Board Space; Pb-Free Packages are Available

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PCB Footprints
MMBT6520LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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3D Models
MMBT6520LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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MMBT6520LT1G Details

  • Manufacturer Part Number:

    MMBT6520LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Emitter Voltage-Max:

    350 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    15

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.225 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    40 MHz

MMBT6520LT1G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MMBT6520LT1G is -55°C to 150°C.
  • To ensure reliability, follow the recommended derating curves for power dissipation and junction temperature, and consider using a heat sink or thermal management system.
  • Use a PCB layout that minimizes thermal resistance and ensures good heat dissipation. A recommended pad design is a thermal pad with a diameter of 1.5 mm to 2.5 mm, and a solder mask opening of 1.1 mm to 2.1 mm.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, and follow proper handling and storage procedures to prevent ESD damage.
  • Use a soldering temperature of 260°C to 280°C, with a soldering time of 10 seconds to 30 seconds. Avoid using excessive soldering temperatures or times to prevent damage to the device.

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MMBT6520LT1G Overview

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