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MMDT2227-TP - MCC

Description: Small Signal Bipolar Transistors

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Symbol
MMDT2227-TP - MCC - PCB symbol
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PCB Footprints
MMDT2227-TP - MCC PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT-363
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3D Models
MMDT2227-TP - MCC - 3D model - SOT23 (6-Pin) - SOT-363
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MMDT2227-TP Details

  • Manufacturer Part Number:

    MMDT2227-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, ULTRA SMALL, PLASTIC PACKAGE-6

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.6 A

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    35

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Power Dissipation-Max (Abs):

    0.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    300 MHz

MMDT2227-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for MMDT2227-TP is a standard SOT23 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a thermal pad connected to the ground pin.
  • To ensure reliable operation of MMDT2227-TP in high-temperature environments, it is recommended to derate the maximum junction temperature (Tj) by 1°C for every 1W of power dissipation above 0.5W, and to use a heat sink or thermal management system to keep the junction temperature below 150°C.
  • The maximum safe operating area (SOA) for MMDT2227-TP is defined by the maximum voltage and current ratings, which are 40V and 1A respectively. Operating the device outside of this area can lead to reduced reliability and potential failure.
  • To handle ESD protection for MMDT2227-TP, it is recommended to use a human body model (HBM) ESD protection circuit with a minimum rating of 2kV, and to follow proper handling and storage procedures to prevent ESD damage.
  • The recommended storage condition for MMDT2227-TP is in a dry, cool place with a temperature range of -40°C to 125°C and a relative humidity of 60% or less, in accordance with IPC/JEDEC J-STD-033C.

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MMDT2227-TP Overview

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